Key Features:
✅ Low thermal expansion coefficient (matching Mo/Na alloys)
✅ High thermal conductivity (exceeding 200 W/m·K)
✅ Hermetic surface without gas permeability concerns
✅ Easy metallurgical bonding with copper layers
Application Benefits
· Power Semiconductor Devices
· 5G RF Systems
· Aerospace & Defense Electronics
· High-Speed Communication Modules
