With years of expertise in precision manufacturing of semiconductor microelectronic packaging materials and components, we specialize in R&D, production and processing of: Mo-Cu, W-Cu, Cu alloy, AlSiC, Cu-Diamond, Al- Diamond, Pure Diamond, Kovar, etc. Leveraging advanced forging, stamping and machining technologies, we deliver premium products widely applied in: Power Semiconductor Device Packaging, 5G Communication Base Station Antennas, IGBT Heat Sink Systems, Aerospace & Marine Applications, 2.5D/3D CoWas Packaging.