About Us

Cooperation • Win-Win • Innovation • Development

With years of expertise in precision manufacturing of semiconductor microelectronic packaging materials and components, we specialize in R&D, production and processing of: Mo-Cu, W-Cu, Cu alloy, AlSiC, Cu-Diamond, Al- Diamond, Pure Diamond, Kovar, etc. Leveraging advanced forging, stamping and machining technologies, we deliver premium products widely applied in: Power Semiconductor Device Packaging, 5G Communication Base Station Antennas, IGBT Heat Sink Systems, Aerospace & Marine Applications, 2.5D/3D CoWas Packaging.

Our goal is clear and firm

Contribute to the strategic planning of the group and create a brilliant future together!

2013

DALANG QINFENG was born from a start-up team of only 20 people, and then gradually grew to a size of about 40 people, specializing in providing OEM services for industry giants such as Foxconn, SZEC, and FIAT.

2016

We joined hands with BYD to work on the research and development of cold forging process for IGBT heat dissipation copper substrate, and achieved a breakthrough success in 2017.

2019

With the continuous expansion of business, Dongguan Fenghuangtai Hardware & Plastic Co., Ltd. came into being, and the team size was expanded to more than 80 people, realizing the small batch production of heat dissipation copper substrate.

2021

In order to further broaden the industrial pattern, we established Guangdong Thermal Conductivity Precision Technology Co., Ltd. and the team size was rapidly expanded to 200 people, and the annual production capacity of IGBT copper substrate was jumped to 3 million pieces.

2023

The original team joined hands with Hengzhao Group (including Dongguan Hengzhao and Guangdong Hengzhao Technology) to establish Guangdong Hengtai Precision Manufacturing Co., Ltd. and expanded the business scope to include the R&D, production and manufacturing of IGBT heat dissipation copper substrate and other kinds of heat dissipation materials, hardware and other products.