Advanced thermal interface for high-power semiconductor devices, offering enhanced heat dissipation and structural integrity. Applications include: Power Modules, RF Systems, AI Chip Packaging, High-Speed Communication Devices.
Production process:
1. Mold Design & Development → 2. Precision Stamping → 3. Cold Forging → 4. CNC Machining → 5.Cleaning → 6. Annealing → 7. Inspection Testing → 8. Solder Resist/Patterning → 9. Plating → 10. Sand Blasting → 11. Finished Product Storage
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