W-Cu

Product Characteristics

W-Cu are eutectoid-free composites combining tungsten’s high thermal conductivity (180-230 W/m·K), high melting point (>3400°C), and low thermal expansion coefficient with copper’s excellent machinability.

Our alloys achieve:

✓ Near-perfect metallurgical bonding
✓ Ultra-compact microstructure (<5×10⁻⁹ Pa·m³ helium leak rate)
✓ Tailored W/Cu ratios (x+y=100) for customized performance